Edge Server Immersion Enclosure
The DCX Edge Server Immersion Enclosure is a compact, high-efficiency liquid cooling solution purpose-built for edge computing environments supporting AI workloads, 5G infrastructure, and low-latency data processing. The system enables deployment of high-density GPU servers directly at the network edge, minimizing data transfer latency and reducing dependency on centralized data centers. Designed for both indoor and outdoor environments, it enables flexible installation without requiring complex infrastructure modifications. The system supports standard 19”, 21”, and ORV3 server architectures, with depths of up to 850 mm, ensuring broad platform compatibility with modern edge hardware. Its modular and space-optimized design allows for easy deployment in constrained environments, including micro data centers and containerized edge installations. The architecture is optimized for stable fluid dynamics and efficient heat exchange, ensuring predictable operation, low maintenance requirements, and high energy efficiency in distributed edge computing scenarios.
Capacity
Compact immersion system enabling high-density compute in space-constrained edge environments.
Performance
Stable high-frequency operation enabled by targeted flow heat transfer without thermal throttling.
Sustainability
Reduced carbon footprint through minimized reliance on air cooling and improved thermal efficiency.
Energy Efficiency
Lower energy consumption via precise heat removal and reduced cooling overhead.
Overview
The DCX Edge Immersion Server Enclosure is a compact immersion system engineered to deliver efficient and reliable cooling for edge and 5G deployments, enabling localized high-performance computing in distributed environments. Designed to support modern AI and telecom workloads, the system delivers high-density processing capabilities while eliminating the constraints of traditional air-cooled infrastructure. With support for up to 7 servers (7U capacity) in industry-standard 19” form factor, the enclosure provides an optimal balance between compute density and minimal footprint, making it ideal for micro data centers, containerized deployments, and standalone edge installations. Its compact and infrastructure-light design allows for rapid deployment without the need for complex facility adaptations. The system is capable of handling up to 28 kW of IT thermal load, enabled by an integrated immersion cooling architecture with optimized fluid dynamics and high-efficiency heat transfer. The internal system includes an electronic pump, integrated PDU, and a high-capacity heat exchanger, ensuring stable and predictable operation across varying workload conditions.
Features
- Designed specifically for distributed infrastructure, enabling high-performance computing directly at the network edge with minimal footprint and rapid deployment capability.
- Supports up to 28 kW heat dissipation within a 7U enclosure, delivering high compute density without the need for oversized infrastructure.
- Industry-standard immersion enclosure compatible with 19”, 21”, and ORV3 server platforms.
- With 850 mm IT equipment immersion depth fits most servers on the market.
- Available with redundant pump configurations, ensuring continuous operation and high availability in remote or hard-to-service locations.
- Stable operating conditions and the absence of air contamination (dust, humidity) significantly reduce component degradation and maintenance requirements.
Features
- Lower carbon footprint enabled by liquid cooling architecture and minimized use of HVAC systems.
- Improved server reliability through precise temperature control and elimination of hotspots.
- Extended hardware lifespan with stable thermal conditions and reduced failure rates.
- Quiet and efficient operation with minimal noise compared to conventional air-cooled systems.
- Available as a standalone unit or integrated solution, with support for OEM customization, branding, and compatibility with dry coolers and auxiliary infrastructure.
- Supports remote system monitoring, enabling real-time performance tracking and predictive maintenance for distributed edge installations.
- Modular design allows incremental scaling of edge capacity, aligned with growing AI, telecom, and low-latency computing requirements.
System Build
Built on a highly compact and edge-optimized footprint, the DCX Edge Immersion Server Enclosure is engineered to deliver efficient liquid cooling for low- to medium-power edge compute workloads. The enclosure supports industry-standard 19-21” and OVR3 hardware, with an immersion depth of 850 mm, enabling compatibility with a wide range of server architectures deployed in edge environments. The enclosure features a structured internal architecture consisting of a dedicated immersion zone for compute hardware, an integrated hydraulic section, and a simplified control interface.
This streamlined layout is optimized for edge deployments where space constraints, ease of service, and operational simplicity are critical. The hydraulic system is equipped with dual pumps configured in full 2N redundancy, ensuring continuous operation and high reliability even in scenarios requiring uninterrupted uptime. This level of redundancy is particularly relevant for edge data centers and remote installations, where service interventions may be limited. Built with a focus on modularity, rapid deployment, and operational reliability, the DCX Edge provides a compact, scalable platform for edge computing applications, combining efficient thermal performance, a simplified system architecture, and fully redundant hydraulic operation.
Steel cover to prevent contamination, with spill prevention components.
All-steel enclosure big enough to house up to 400kg of dielectric fluid and miners. Building block for the rack or scale-out container installations. Enables high-temperature mining for the best heat transfer parameters. No more plastic boxes that can crack, leak or melt anytime, no more problems with temperature limits, no more problems with grounding.
L shaped frames to mount external components – switchgear, monitoring systems or PSUs. Placement of PSU outside of the immersion bath requires more retrofitting for the miners, but enables even bigger density and higher temperature for better heat exchange.
IP40 switchgear box for 10-12 3-4kW miners. Contains: 10-12 x overcurrent protection, circuit breaker, cable fittings, terminal blocks, cabling. We use top class Schneider, Eaton, Legrand or Siemens components.
Miner stack area. Sized carefully taking into account various miner types. Allows for flexible placement of different miners. Including: 15x Whatsminer M20/M30/M31 12x Whatsminer M21 8x Antminer S17+ / S17e / T17+ 8x Antminer S19 / S19PRO / T19 10x Innosilicon A10 PRO / A9 / A6 23x Innosilicon A10 (500M) 18x Antminer S9SE / S9K 20x Antminer S9I / S9J 8-16 x Mining rig with up to 12 GPU each 6-7x Hummer H1 Miner 5x Antminer K5 CKB Eaglesong 8-16 GPU rigs with 12GPU each (96-192GPUS)
ThermaSafe R™ Dielectric Engineered Fluid Best priced, 2 times better than recognized Bitcool BC-888 ASIC miner dielectric coolant. Dielectric, odorless, non-toxic, non-allergenic, long-life, eco friendly and safe HTF (Heat Transfer Fluid). Designed specifically for crypto mining operations, compatible with most ASIC, GPU and electronic equipment.
Filling kit. Flexible miners require more effort on fluid control. We want all the fluid to go through the miners not around. To enable a higher pressure drop around the miners we deliver filling kits which direct the fluid through the miners.
Sustainable high performance computing
As computing power constantly increases, liquid cooling becomes a necessary solution to replace conventional air cooling. DCX Immersion Systems stands out as the most powerful, compact, sustainable, and energy-efficient data center cooling technology available today.
Get in Touch
We will advise, guide and support – the ideas are always free of charge!
Get your custom solution:
We need basic information to design custom liquid cooling system:
-
Quantity and general specification and dimensions of servers, ICT systems or other to be cooled components, along with power allocation per device or rack.
-
Brief overview of your project along with your main objective: better performance, water savings, energy efficiency, heat reuse, higher density?
-
Preferred liquid cooling technology: direct chip – coldplate system or immersion solution? Planned heat rejection or heat recovery strategy.
-
Country & city nearby planed location for climate data, heat transfer performance & shipping cost estimate.