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DCX H1000 Immersion Enclosure

Standard Immersion Enclosure

The DCX H1000 immersion enclosure is a high-density cooling solution engineered for scalable AI and HPC deployments. Designed around the industry-standard IT rack footprint (800×1200 mm), it enables seamless integration into existing data center environments without requiring fundamental infrastructure changes. The system supports standard 19”, 21”, and ORV3 server architectures with depths of up to 900 mm, ensuring broad platform compatibility. Its modular, vanity-free design allows flexible deployment configurations, including both wide and high-density narrow layouts, optimizing space utilization across different facility types, from enterprise data centers to edge and containerized installations. With a cooling capacity of up to 140 kW per rack, the H1000 delivers consistent thermal performance for next-generation high-power workloads. The enclosure architecture is optimized for efficient heat transfer and stable fluid dynamics, supporting predictable operation under sustained high loads.

Capacity

Up to 80 kW per server at 27°C, scaling to 140 kW per rack configuration.

Performance

Stable high-frequency operation enabled by targeted flow heat transfer without thermal throttling.

Sustainability

Reduced carbon footprint through minimized reliance on air cooling and improved thermal efficiency.

Energy Efficiency

Lower energy consumption via precise heat removal and reduced cooling overhead.

Overview

The DCX H1000 is a standard immersion enclosure engineered to deliver efficient, scalable cooling for high-density workloads. H1000 enables high-density deployments beyond traditional air-cooled systems, supporting up to 140 kW per rack in full rack configuration with high heat transfer efficiency. Built around a true industry-standard IT rack footprint (800×1200), H1000 introduces a new level of standardization to immersion cooling, enabling seamless integration into both existing data centers and containerized edge environments. Its compact, modular, and infrastructure-ready design supports both wide and high-density narrow arrangements, providing maximum flexibility in layout and deployment. The system is fully compatible with 19”, 21”, and OCP ORV3 server architectures, supporting hardware up to 900 mm in depth and ensuring broad interoperability across enterprise and hyperscale platforms. Precise temperature control across the system ensures uniform thermal conditions, eliminating hotspots that typically degrade hardware performance. This directly translates into increased server reliability, extended component lifespan, and a reduced risk of costly hardware failures, critical for continuous, high-load operation environments.

Features

  • High-density immersion cooling system engineered for AI and HPC workloads in standard IT rack footprint
  • Industry-standard immersion enclosure compatible with 19”, 21” and ORV3 server platforms
  • Rack-based immersion system designed around 800×1200 mm footprint for seamless data center integration
  • Up to 80 kW heat transfer per server and up to 140 kW per full rack configuration
  • Flexible rack architecture supporting 22RU immersion + 2RU air or 44RU immersion + 4RU air setups
  • Targeted flow cooling enabling higher CPU/GPU performance without thermal throttling
  • Precision cooling approach reducing energy consumption and operational costs
  • Integrated industrial pump system with N+1 or N+2 redundancy for high availability deployments
  • Compact and modular design enabling deployment in enterprise, edge and containerized environments
  • Easy access to pumps and heat exchanger compartment for simplified maintenance
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Product model STANDARD IMMERSION ENCLOSURE
Cooling capacity
Standard Heat Transfer Capacity [kW] | 32 ºC / 89.6 ºF 61 kW
Standard Rack Heat Transfer Capacity [kW] | 32 ºC / 89.6 ºF 122 kW
Maximum Heat Transfer Capacity [kW] | 27 ºC / 80.6 ºF 70 kW
Maximum Rack Heat Transfer Capacity [kW] | 27 ºC / 80.6 ºF 140 kW
Mechanical Specification
IT Hardware Form Factor Industry Standard 19” - 21” & OVR3 Standard
Equipment Immersion Depth 900 mm
Enclosure Hosting Capacity (RU) 22 RU immersion cooled + 2RU air cooled
Immersion Rack Hosting Capacity (RU) 44 RU immersion cooled + 4RU air cooled
Engineered Fluid amount ( L / gal) 560-570 L | 148-151 gal
Standard Supply Temperature & Range
Monitoring Temp in / out on secondary and primary loop
Standard supply temperature ≤ 32 ºC / 89.6 ºF
Supply temperature range Min ≤ 32 ºC / 89.6 ºF | Max 40 ºC / 104 ºF
Power Specification
Power consumption (W) 600-1200-1800 W (3 × 600 W)
Built-in redundancy N+1 / N+2 Pump
Power supply 100–240 V ~ 50/60 Hz (20A 120V / 10–16A 230V)
Dimensions (cm/ft) | Rack dimensions 63x131x105 cm / 2.07x4.3x3.44 ft 63x131x232 cm / 2.07x4.3x7.61 ft
Weight & Footprint
Immersion Enclosure Weight | Rack System Weight 380 kg / 750 lb 610 kg / 1345 lb
Total Weight (kg/lb) | Rack Total Weight 975 kg / 2150 lb 1955 kg / 4310 lb
Floor Load Capacity | Rack Floor Load Capacity 1514.9 kg/m2 | 310.3 lb/ft2 2715 kg/m2 | 556.2 lb/ft2
Floor Footprint | Rack Floor Footprint 0.825 m2 / 8.88 ft2 0.72 m2 / 7.75 ft2

Features

  • Lower carbon footprint enabled by liquid cooling architecture and minimized use of HVAC systems.
  • Improved server reliability through precise temperature control and elimination of hotspots.
  • Extended hardware lifespan with stable thermal conditions and reduced failure rates.
  • Quiet and efficient operation with minimal noise compared to conventional air-cooled systems.
  • Scalable architecture supporting single, dual, and triple-level configurations for growing compute demand.
  • Up to 140kW per rack in full rack configuration with exceptional heat transfer efficiency.
  • Maximized ROI through higher power density and compute scaling within the same data center footprint.
  • Reduced operational costs by eliminating reliance on traditional air cooling and lowering energy consumption.
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System Build

Built on a compact, industry-aligned footprint (L 630 mm × W 1310 mm × H 1050 mm), the DCX H1000 is designed as a compatible immersion tank, engineered to deliver efficient, scalable cooling for high-density workloads. The enclosure integrates a clearly defined internal layout, consisting of a compute compartment for immersion-cooled servers, a dedicated networking switch compartment, an isolated hydraulic compartment, and a control panel section. This separation enables optimized thermal and mechanical management while simplifying maintenance and operational access. The hydraulic system incorporates three industrial-grade pumps configured in N+1 or N+2 redundancy, ensuring high availability and stable performance even in remote or mission-critical deployments.

Designed for flexible density configurations, the H1000 supports both 22 RU immersion-cooled + 2 RU air-cooled setups and extended 44 RU immersion-cooled + 4 RU air-cooled configurations. This allows operators to adapt the enclosure to different workload profiles while maintaining consistent cooling performance and infrastructure compatibility. The immersion-based architecture eliminates the need for high-speed airflow, resulting in significantly lower acoustic output than traditional air-cooled systems. This enables quieter operation and improves deployment flexibility in environments where noise and mechanical simplicity are critical considerations. Built with a focus on modularity and integration, the H1000 provides a robust and scalable platform for high-density computing, combining compact form factor, redundant hydraulic design, and a structured internal layout to meet the operational demands of modern AI and HPC infrastructure.

Up to 80 kW per server at 27°C, scaling to 140 kW per rack configuration.

Sustainable high performance computing

As computing power constantly increases, liquid cooling becomes a necessary solution to replace conventional air cooling. DCX HYDRO stands out as the most powerful, compact, sustainable, and energy-efficient data center cooling technology available today.

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We need basic information to design custom liquid cooling system:

  • Quantity and general specification and dimensions of servers, ICT systems or other to be cooled components, along with power allocation per device or rack.

  • Brief overview of your project along with your main objective: better performance, water savings, energy efficiency, heat reuse, higher density?

  • Preferred liquid cooling technology: direct chip – coldplate system or immersion solution? Planned heat rejection or heat recovery strategy.

  • Country & city nearby planed location for climate data, heat transfer performance & shipping cost estimate.

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