DCX ECDU 1380/2600 V1
Enterprise Coolant Distribution Unit
Capacity
1.38 MW - 2.6 MW cooling with flexible deployment
Performance
45°C ultra-efficient cooling with 3°C approach temperature
Sustainability
3666 L/min flow in single pump N+1 operation
Power density
Up to 45°C warm water cooling for high-density IT environments
Overview
Features
- Supports scalable cooling capacity from 1.38 MW to 2.6 MW within a modular CDU platform.
- Flexible connection to primary and secondary loops from either top entry or technical floor interface.
- N+1 redundant pumps delivering over 220 m³/h flow rate and 50 m head pressure, supporting extended and complex secondary loop layouts.
- Integrates a heat exchanger with 3°C approach temperature (AT3), improving on the typical 4°C standard.
- Provides a 12” HMI with remote monitoring and group control functionality.
Features
- Industry-standard compact footprint (L 1.2 m | W 1.2 m | H 2.4 m) enabling seamless integration.
- Integrated coolant monitoring system ensuring long-term fluid quality and stable performance.
- Supports ASHRAE W45 cooling guidelines with low 3°C approach temperatures.
- Chiller energy savings of up to 10% achieved through optimized control and improved heat exchange efficiency.
- Prevents condensation operational risk by maintaining TCS water temperature above room dew point under varying environmental conditions.
System Build
Built on a compact, industry-standard footprint (H 2.4 m × W 1.2 m × D 1.2 m), the DCX ECDU 1380/2600 is designed as a scalable and high-performance coolant distribution platform for liquid-cooled data center environments. The system architecture incorporates redundant pumps and control systems to ensure stable and reliable operation under varying load conditions. The ECDU 1380/2600 supports both localized and distributed cooling topologies, allowing deployment at row level, across rack groups, or within mechanical gallery environments while maintaining consistent hydraulic and control performance.
The unit integrates primary and secondary loop connections with flexible top or bottom interfaces, supporting a wide range of installation layouts. Its control system enables precise thermal management by adjusting flow rates and operating parameters in response to real-time IT load conditions. Designed for high-performance operation, the system achieves a 3°C approach temperature at rated capacity, supporting efficient heat transfer in high-density liquid cooling applications. Built with a focus on serviceability and integration, the platform is engineered to meet the operational and scalability requirements of enterprise and AI-driven data center infrastructure.
3°C The lowest approach temperature in the industry
N+1 redundant pumps, power supplies & controls
12-inch HMI with reomte monitoring and group control capacity
Modular and configurable TCS/FWS inlets & outlets
Get in Touch
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Get your custom solution:
We need basic information to design custom liquid cooling system:
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Quantity and general specification and dimensions of servers, ICT systems or other to be cooled components, along with power allocation per device or rack.
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Brief overview of your project along with your main objective: better performance, water savings, energy efficiency, heat reuse, higher density?
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Preferred liquid cooling technology: direct chip – coldplate system or immersion solution? Planned heat rejection or heat recovery strategy.
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Country & city nearby planed location for climate data, heat transfer performance & shipping cost estimate.