Immersion cooling is a liquid-based thermal management technology in which complete servers are fully submerged in a dielectric, electrically non-conductive fluid. Unlike traditional approaches that target selected components, immersion is a full-contact cooling method in which the coolant surrounds and interacts with all heat-generating elements inside the server. CPUs, GPUs, memory modules, and power electronics transfer heat directly into the fluid, eliminating air as a thermal medium and significantly reducing thermal resistance along the entire heat path. Because the coolant is in direct contact with all active surfaces, heat is removed uniformly and efficiently. This enables extremely high power densities while maintaining stable and predictable operating conditions. The sealed liquid environment isolates IT hardware from dust, humidity variations, and airborne contaminants, improving system reliability and extending equipment lifetime. Immersion Cooling captures 100% of heat by submerging the entire equipment, simplifying thermal management.
DCX Immersion Cooling Systems
Server immersion cooling for high-density computing environments
- Eliminates hotspots by ensuring uniform heat distribution, even in densely packed and airflow-restricted areas.
- Fanless operation removes airflow constraints, reduces noise, and eliminates key mechanical failure points.
- Up to 50% reduction in routine maintenance requirements compared to air-cooled systems.
- Supports ultrahigh rack power densities required for AI and HPC workloads.
- Controlled dielectric environment isolates components from humidity and contamination.
- IT hardware is fully submerged, allowing direct-contact heat transfer and highly efficient cooling.
Standard Immersion Enclosure
The DCX H1000 immersion enclosure is a high-density cooling solution engineered for scalable AI and HPC deployments. Designed around the industry-standard IT rack footprint (800×1200 mm), it enables seamless integration into existing data center environments without requiring fundamental infrastructure changes. The system supports standard 19”, 21”, and ORV3 server architectures with depths of up to 900 mm, ensuring broad platform compatibility. Its modular, vanity-free design allows flexible deployment configurations, including both wide and high-density narrow layouts, optimizing space utilization across different facility types, from enterprise data centers to edge and containerized installations. With a cooling capacity of up to 140 kW per rack, the H1000 delivers consistent thermal performance for next-generation high-power workloads. The enclosure architecture is optimized for efficient heat transfer and stable fluid dynamics, supporting predictable operation under sustained high loads.
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Edge Immersion Enclosure
The DCX Edge Server Immersion Enclosure is a compact, high-efficiency liquid cooling solution purpose-built for edge computing environments supporting AI workloads, 5G infrastructure, and low-latency data processing. The system enables deployment of high-density GPU servers directly at the network edge, minimizing data transfer latency and reducing dependency on centralized data centers. Designed for both indoor and outdoor environments, it enables flexible installation without requiring complex infrastructure modifications. The system supports standard 19”, 21”, and ORV3 server architectures, with depths of up to 850 mm, ensuring broad platform compatibility with modern edge hardware. Its modular and space-optimized design allows for easy deployment in constrained environments, including micro data centers and containerized edge installations. The architecture is optimized for stable fluid dynamics and efficient heat exchange, ensuring predictable operation, low maintenance requirements, and high energy efficiency in distributed edge computing scenarios.
Get the SpecsheetLearn MoreThermaSafe R Dielectric Fluid
ThermaSafe R is an engineered dielectric coolant designed for high-density data center and immersion cooling applications, delivering stable and efficient thermal performance under demanding operating conditions. With an ultra-low viscosity of 5.1 cSt at 40°C, it ensures smooth circulation, reduced hydraulic resistance, and lower pumping energy consumption across large-scale systems. The fluid enables efficient convective heat transfer, supporting uniform temperature distribution and reliable operation in high heat flux environments. Based on ULTRAPURE™ PAO (Group IV) technology, it provides exceptional chemical stability and a service life of up to 10 years with minimal degradation. Its ultra-pure formulation contains no metals, sulphur, heteroatoms, or sediments, with water content maintained below 50 ppm, ensuring maximum hardware protection and long-term system cleanliness. Low foaming characteristics and stable flow behavior support consistent performance in immersion and closed-loop cooling systems. The fluid is non-toxic and biodegradable, allowing safe handling, operation, and disposal without special procedures. Low aromatic content and high purity reduce oxidation risk and maintain consistent dielectric properties over time. The combination of thermal efficiency, chemical purity, and operational stability makes it suitable for scalable, high-reliability cooling infrastructure.
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Dielectric Solvent
Dielectric Solvent is a fully synthetic, crystal-clear cleaning fluid engineered for safe and effective maintenance of ASICs, GPUs, servers, and other sensitive electronic components. Designed as both a solvent and precision cleaner, it efficiently removes hydrocarbon-based heat transfer fluids and contaminants without leaving any residue or surface deposits. Its residue-free performance ensures components remain clean, dry, and immediately ready for operation, transport, or reuse. The formulation is non-toxic, non-allergenic, and odorless, enabling safe handling intdfgas operational environments without special procedures. Fully biodegradable and environmentally compatible, it supports sustainable data center and industrial practices. A high flash point of 160 °C ensures safe storage, transport, and use even in demanding operational conditions. The fluid maintains long-term chemical stability, with an engineered lifespan exceeding 10 years under controlled usage conditions. Its low surface tension and optimized solvency enable rapid penetration and effective cleaning of complex electronic assemblies. Compatible with a wide range of materials used in electronic hardware, it eliminates risk of damage during cleaning processes. Dielectric Solvent delivers a balanced combination of safety, performance, and cost efficiency, making it suitable for large-scale maintenance operations and refurbishment workflows.
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We’re DCX, a team of liquid cooling experts. We pride ourselves on being at the forefront of sustainable innovation, developing a unique and smart solutions for data center and telecommunication sector. Our goal is to create future industry standards in liquid cooling technology and to transform the industry forever.
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